{"id":57466,"date":"2026-11-10T22:36:00","date_gmt":"2026-11-10T21:36:00","guid":{"rendered":"https:\/\/www.chinasmartbuy.com\/blog\/?p=57466"},"modified":"2026-11-10T13:56:03","modified_gmt":"2026-11-10T12:56:03","slug":"samsung-3d-cube-h-primo-pdk-inizio-2027","status":"publish","type":"post","link":"https:\/\/www.chinasmartbuy.com\/blog\/samsung-3d-cube-h-primo-pdk-inizio-2027\/","title":{"rendered":"Samsung punta al primo PDK 3D Cube-H a inizio 2027"},"content":{"rendered":"\n<article class=\"rh-classic-article\"><p>Samsung punterebbe a completare il primo kit di progettazione, o PDK, per il packaging 3D Cube-H all\u2019inizio del 2027. Seguirebbero valutazioni con potenziali clienti: si tratta di una tappa di sviluppo, ancora precedente a un\u2019eventuale produzione commerciale.<\/p>\n<p>Il packaging definisce il modo in cui i chip vengono assemblati e collegati. 3D Cube-H consentirebbe di impilare verticalmente pi\u00f9 chip logici, con un\u2019attenzione particolare ai processori per l\u2019intelligenza artificiale.<\/p>\n<p>La variante H usa l\u2019hybrid bonding, mentre la 3D Cube-T gi\u00e0 sviluppata ricorre al collegamento per termocompressione. L\u2019obiettivo indicato \u00e8 una distanza fra i punti di connessione di circa 6 micrometri, contro almeno 25 micrometri per la soluzione TC.<\/p>\n<p>Connessioni pi\u00f9 ravvicinate permetterebbero di aumentare i collegamenti tra chip nello stesso ingombro. Sono prospettati anche consumi inferiori per bit e vantaggi termici, ma restano benefici potenziali, senza risultati pubblici quantificati.<\/p><\/article><p class=\"rh-attribution-pills\" style=\"margin:16px 0 0\"><a href=\"https:\/\/www.ithome.com\/1\/024\/862.htm\" target=\"_blank\" rel=\"noopener\" title=\"Via: VIA\" aria-label=\"Via: VIA\"><strong>Via<\/strong><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Samsung lavorerebbe al primo kit 3D Cube-H per inizio 2027: packaging con chip impilati e collegamenti pi\u00f9 fitti, ancora in sviluppo.<\/p>\n","protected":false},"author":17,"featured_media":57423,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_exactmetrics_skip_tracking":false,"_yoast_wpseo_focuskw_text_input":"Samsung 3D Cube-H","footnotes":""},"categories":[480],"tags":[542],"class_list":["post-57466","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-samsung"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Samsung punta al primo PDK 3D Cube-H a inizio 2027<\/title>\n<meta name=\"description\" content=\"Samsung lavorerebbe al primo kit 3D Cube-H per inizio 2027: packaging con chip impilati e collegamenti pi\u00f9 fitti, ancora in sviluppo.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.chinasmartbuy.com\/blog\/samsung-3d-cube-h-primo-pdk-inizio-2027\/\" \/>\n<meta property=\"og:locale\" content=\"it_IT\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Samsung punta al primo PDK 3D Cube-H a inizio 2027\" \/>\n<meta property=\"og:description\" content=\"Samsung lavorerebbe al primo kit 3D Cube-H per inizio 2027: packaging con chip impilati e collegamenti pi\u00f9 fitti, ancora in sviluppo.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.chinasmartbuy.com\/blog\/samsung-3d-cube-h-primo-pdk-inizio-2027\/\" \/>\n<meta property=\"og:site_name\" content=\"ChinaSmartBuy\" \/>\n<meta property=\"article:publisher\" content=\"http:\/\/facebook.com\/chinasmartbuy\" \/>\n<meta property=\"article:published_time\" content=\"2026-11-10T21:36:00+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/11\/csb-cover-generica-samsung-20261110.png\" \/>\n\t<meta property=\"og:image:width\" content=\"1200\" \/>\n\t<meta property=\"og:image:height\" content=\"675\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"Antonio Simonetti\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Scritto da\" \/>\n\t<meta name=\"twitter:data1\" content=\"Antonio Simonetti\" \/>\n\t<meta name=\"twitter:label2\" content=\"Tempo di lettura stimato\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minuto\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.chinasmartbuy.com\\\/blog\\\/samsung-3d-cube-h-primo-pdk-inizio-2027\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.chinasmartbuy.com\\\/blog\\\/samsung-3d-cube-h-primo-pdk-inizio-2027\\\/\"},\"author\":{\"name\":\"Antonio Simonetti\",\"@id\":\"https:\\\/\\\/www.chinasmartbuy.com\\\/blog\\\/#\\\/schema\\\/person\\\/d1c4121518e2f750768e1c993659b364\"},\"headline\":\"Samsung punta al primo PDK 3D Cube-H a inizio 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