{"id":46986,"date":"2026-09-08T15:21:00","date_gmt":"2026-09-08T13:21:00","guid":{"rendered":"https:\/\/www.chinasmartbuy.com\/blog\/qualcomm-amazon-chip-ai-custom-interconnessioni-ottiche-1\/"},"modified":"2026-09-08T15:22:32","modified_gmt":"2026-09-08T13:22:32","slug":"qualcomm-amazon-chip-ai-custom-interconnessioni-ottiche-1","status":"publish","type":"post","link":"https:\/\/www.chinasmartbuy.com\/blog\/qualcomm-amazon-chip-ai-custom-interconnessioni-ottiche-1\/","title":{"rendered":"Qualcomm e Amazon insieme su chip AI custom e interconnessioni ottiche 1,6T"},"content":{"rendered":"\n\n<style>\n  :root {\n    --red: #CC1B1B;\n    --red-light: rgba(204,27,27,0.08);\n    --red-mid: #e84040;\n    --accent-soft-bg: rgba(204,27,27,0.07);\n    --accent-soft-border: rgba(204,27,27,0.18);\n    --text: #1a1a1a;\n    --text-muted: #666;\n    --card: #ffffff;\n    --border: #ebebeb;\n    --page-bg: #ffffff;\n    --surface-soft: #fafafa;\n    --surface-contrast: #f0f0f0;\n    --line-soft: #f5f5f5;\n    --soft-label: #bbb;\n    --muted-label: #999;\n    --copy: #333;\n    --font-head: 'Bebas Neue', sans-serif;\n    --font-body: 'DM Sans', sans-serif;\n    --heading-spacing: 0.04em;\n    --heading-weight: 400;\n    --spec-header-spacing: 0.08em;\n    --quickfacts-shadow: 0 10px 24px rgba(15,23,42,0.06);\n  }\n  .fbp5-wrap,.fbp5-wrap * { box-sizing:border-box; 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gap:40px; }\n    .fbp5-section h2 { font-size:32px; }\n    .fbp5-scheda-row { flex-direction:column; }\n    .fbp5-scheda-key { width:100%; }\n    .rh-phonebox-header { padding:18px 16px; flex-direction:column; align-items:center; }\n    .rh-phonebox-hero { width:150px; height:200px; }\n    .rh-phonebox-highlights { grid-template-columns:repeat(2,minmax(0,1fr)); }\n    .rh-phonebox-colors { padding:16px; }\n    .rh-phonebox-section { grid-template-columns:1fr; }\n    .rh-phonebox-section-label { padding:14px 20px; border-right:none; border-bottom:1px solid var(--border); }\n    .rh-phonebox-section-values { padding:14px 20px; }\n    .rh-affbox-grid { grid-template-columns:1fr; }\n    .rh-affbox-col:not(:last-child) { border-right:none; border-bottom:1px solid var(--line-soft); }\n    .rh-affbox-cta { width:100%; }\n    .rh-downloadjump { align-items:flex-start; flex-direction:column; margin:-22px 0 0; }\n    .rh-downloadjump a { width:100%; }\n    .rh-downloadbox-head { flex-direction:column; }\n    .rh-downloadbox-link { width:100%; }\n    .rh-offerbox-head { flex-direction:column; }\n    .rh-offerbox-links { grid-template-columns:1fr; }\n    .rh-offer-inline-wrap { flex-direction:column; align-items:flex-start; }\n    .rh-offer-inline-cta { width:100%; }\n  }\n<\/style>\n<div class=\"fbp5-wrap rh-json-article\" id=\"rh-article-mtsp8943-vyxbf\" data-rh-article-type=\"news\" data-rh-site-profile=\"china-smart-buy\">\n  <div class=\"fbp5-intro\">\n    \n    <p>Qualcomm e Amazon hanno annunciato una collaborazione strategica di lungo periodo per sviluppare chip personalizzati destinati ai data center AI e nuove soluzioni di interconnessione ottica fino a <strong>1,6T<\/strong>. L\u2019intesa punta a coprire pi\u00f9 generazioni di prodotto e si concentra soprattutto sull\u2019inferenza AI e sulla scalabilit\u00e0 dell\u2019infrastruttura.<\/p><p>L\u2019accordo unisce da una parte la piattaforma cloud e l\u2019infrastruttura AI di AWS, dall\u2019altra l\u2019esperienza di Qualcomm nella progettazione di processori a basso consumo, nell\u2019integrazione di sistema e nelle tecnologie di connessione ad alta velocit\u00e0. Il mercato ha reagito subito alla notizia, con il titolo Qualcomm in forte rialzo nel premercato.<\/p>\n  <\/div><figure class=\"wp-block-image size-large\" style=\"margin:18px 0;display:block;clear:both;width:100%;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/09\/qualcomm-e-amazon-insieme-su-chip-ai-custom-e-interconnessioni-ottiche-1-143cf272-2680-4d4e-a69f.webp\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/09\/qualcomm-e-amazon-insieme-su-chip-ai-custom-e-interconnessioni-ottiche-1-143cf272-2680-4d4e-a69f.webp\" alt=\"\u9ad8\u901a\u4e0e\u4e9a\u9a6c\u900a\u8fbe\u6210\u5408\u4f5c\uff0c\u5171\u540c\u6253\u9020 AI \u5b9a\u5236\u82af\u7247\u4e0e 1.6T \u5149\u4e92\u8054\u89e3\u51b3\u65b9\u6848\" loading=\"lazy\" style=\"display:block;max-width:100%;height:auto;margin:0 auto;pointer-events:auto\"><\/a><\/figure>\n  \n\n      <section class=\"fbp5-section\">\n        \n        <h2>La partnership punta su chip AI su misura e <span>interconnessioni pi\u00f9 veloci<\/span><\/h2>\n        <p>Il cuore dell\u2019intesa \u00e8 la realizzazione di chip custom per grandi data center AI, pensati per essere distribuiti su larga scala. Il focus dichiarato \u00e8 l\u2019inferenza, ci\u00f2\u00e8 la fase in cui i modelli gi\u00e0 addestrati vengono eseguiti per generare risposte o elaborare dati, un ambito in cui efficienza energetica, latenza e rapporto prestazioni-costi stanno diventando sempre pi\u00f9 centrali.<\/p><p>Accanto ai processori, Qualcomm e Amazon lavoreranno a una piattaforma di collegamento ottico ad alte prestazioni capace di arrivare fino a <strong>1,6 terabit<\/strong>. Per questo fronte verranno sfruttate le competenze di Qualcomm nelle tecnologie SerDes, i serializzatori e deserializzatori ad alta velocit\u00e0 usati per il trasferimento dati, insieme ai DSP ottici.<\/p>\n        \n        \n        \n        \n        \n      <\/section>\n    \n\n      <section class=\"fbp5-section\">\n        \n        <h2>AWS e Qualcomm vogliono accelerare efficienza e <span>tempi di sviluppo<\/span><\/h2>\n        <p>L\u2019operazione si inserisce in una fase in cui i carichi AI stanno aumentando rapidamente e stanno mettendo pressione su compute, storage, networking e larghezza di banda della memoria. In questo scenario Amazon punta a rafforzare un\u2019infrastruttura che promette sicurezza, scalabilit\u00e0 e convenienza operativa, mentre Qualcomm porta in dote il proprio know-how sui chip ad alta efficienza.<\/p><p>La collaborazione prevede anche un uso pi\u00f9 esteso dell\u2019infrastruttura AI di AWS da parte di Qualcomm. L\u2019azienda aumenter\u00e0 l\u2019adozione di servizi come Amazon Bedrock e li applicher\u00e0 ai carichi EDA, ci\u00f2\u00e8 agli strumenti di automazione per la progettazione elettronica, con l\u2019obiettivo di accorciare il ciclo di sviluppo dei chip.<\/p>\n        \n        \n        \n        \n        \n      <\/section>\n    \n\n      <section class=\"fbp5-section\">\n        \n        <h2>C\u2019\u00e8 anche una componente finanziaria rilevante nell\u2019accordo tra le <span>due aziende<\/span><\/h2>\n        <p>Nei documenti depositati presso la SEC emerge anche un secondo livello dell\u2019operazione. Qualcomm ha emesso a favore di un\u2019affiliata di Amazon un warrant che consente di acquistare fino a 25 milioni di azioni ordinarie al prezzo di esercizio di <strong>161,26 dollari<\/strong> per azione, pari a circa <strong>145 euro<\/strong>. Il warrant potr\u00e0 essere esercitato fino al 3 settembre 2036 anche in modalit\u00e0 cashless.<\/p><p>Il valore complessivo collegato ai pagamenti previsti dall\u2019accordo pu\u00f2 arrivare fino a <strong>60 miliardi di dollari<\/strong>, ci\u00f2\u00e8 circa <strong>55 miliardi di euro<\/strong>. Una parte delle azioni, 3,75 milioni, risulta gi\u00e0 maturata al momento dell\u2019emissione sulla base degli impegni iniziali di acquisto.<\/p>\n        \n        \n        \n        \n        \n      <\/section>\n    \n<\/div><div class=\"rh-attribution-pills\" style=\"display:flex;gap:10px;flex-wrap:wrap;justify-content:flex-start;margin:16px 0 0\"><a href=\"https:\/\/www.ithome.com\/0\/999\/925.htm\" target=\"_blank\" rel=\"noopener\" title=\"Via: VIA\" aria-label=\"Via: VIA\" style=\"display:inline-flex;align-items:center;gap:8px;padding:10px 16px;border-radius:16px;background:linear-gradient(135deg,#fff7ed,#ffedd5);color:#c2410c;text-decoration:none;font-size:11px;font-weight:900;letter-spacing:.08em;text-transform:uppercase;border:1px solid rgba(249,115,22,.20);box-shadow:0 8px 22px rgba(249,115,22,.08)\">Via<\/a><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Qualcomm e Amazon collaboreranno su chip AI per data center, inferenza e interconnessioni ottiche fino a 1,6T, con una componente finanziaria molto ampia.<\/p>\n","protected":false},"author":15,"featured_media":46985,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_exactmetrics_skip_tracking":false,"_yoast_wpseo_focuskw_text_input":"Qualcomm Amazon chip AI custom","footnotes":""},"categories":[480],"tags":[933],"class_list":["post-46986","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-ai"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Qualcomm e Amazon insieme su chip AI custom e interconnessioni ottiche 1,6T<\/title>\n<meta name=\"description\" content=\"Qualcomm e Amazon avviano una partnership pluriennale per chip AI personalizzati, inferenza nei data center e soluzioni ottiche fino a 1,6T.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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