{"id":45443,"date":"2026-08-31T06:22:00","date_gmt":"2026-08-31T04:22:00","guid":{"rendered":"https:\/\/www.chinasmartbuy.com\/blog\/sk-hynix-smentita-intel-foundry-base-die-hbm4\/"},"modified":"2026-08-31T06:23:09","modified_gmt":"2026-08-31T04:23:09","slug":"sk-hynix-smentita-intel-foundry-base-die-hbm4","status":"publish","type":"post","link":"https:\/\/www.chinasmartbuy.com\/blog\/sk-hynix-smentita-intel-foundry-base-die-hbm4\/","title":{"rendered":"SK Hynix frena sulle voci su Intel Foundry per i base die HBM"},"content":{"rendered":"\n\n<style>\n  :root {\n    --red: #CC1B1B;\n    --red-light: rgba(204,27,27,0.08);\n    --red-mid: #e84040;\n    --accent-soft-bg: rgba(204,27,27,0.07);\n    --accent-soft-border: rgba(204,27,27,0.18);\n    --text: #1a1a1a;\n    --text-muted: #666;\n    --card: #ffffff;\n    --border: #ebebeb;\n    --page-bg: #ffffff;\n    --surface-soft: #fafafa;\n    --surface-contrast: #f0f0f0;\n    --line-soft: #f5f5f5;\n    --soft-label: #bbb;\n    --muted-label: #999;\n    --copy: #333;\n    --font-head: 'Bebas Neue', sans-serif;\n    --font-body: 'DM Sans', sans-serif;\n    --heading-spacing: 0.04em;\n    --heading-weight: 400;\n    --spec-header-spacing: 0.08em;\n    --quickfacts-shadow: 0 10px 24px rgba(15,23,42,0.06);\n  }\n  .fbp5-wrap,.fbp5-wrap * { box-sizing:border-box; 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gap:40px; }\n    .fbp5-section h2 { font-size:32px; }\n    .fbp5-scheda-row { flex-direction:column; }\n    .fbp5-scheda-key { width:100%; }\n    .rh-phonebox-header { padding:18px 16px; flex-direction:column; align-items:center; }\n    .rh-phonebox-hero { width:150px; height:200px; }\n    .rh-phonebox-highlights { grid-template-columns:repeat(2,minmax(0,1fr)); }\n    .rh-phonebox-colors { padding:16px; }\n    .rh-phonebox-section { grid-template-columns:1fr; }\n    .rh-phonebox-section-label { padding:14px 20px; border-right:none; border-bottom:1px solid var(--border); }\n    .rh-phonebox-section-values { padding:14px 20px; }\n    .rh-affbox-grid { grid-template-columns:1fr; }\n    .rh-affbox-col:not(:last-child) { border-right:none; border-bottom:1px solid var(--line-soft); }\n    .rh-affbox-cta { width:100%; }\n    .rh-downloadjump { align-items:flex-start; flex-direction:column; margin:-22px 0 0; }\n    .rh-downloadjump a { width:100%; }\n    .rh-downloadbox-head { flex-direction:column; }\n    .rh-downloadbox-link { width:100%; }\n    .rh-offerbox-head { flex-direction:column; }\n    .rh-offerbox-links { grid-template-columns:1fr; }\n    .rh-offer-inline-wrap { flex-direction:column; align-items:flex-start; }\n    .rh-offer-inline-cta { width:100%; }\n  }\n<\/style>\n<div class=\"fbp5-wrap rh-json-article\" id=\"rh-article-mtgqfnbc-hjc7w\" data-rh-article-type=\"news\" data-rh-site-profile=\"china-smart-buy\">\n  <div class=\"fbp5-intro\">\n    \n    <p>SK Hynix ha smentito in parte le indiscrezioni secondo cui starebbe valutando Intel Foundry per la produzione dei base die delle future memorie HBM. L\u2019azienda ha dichiarato che alcuni contenuti diffusi sulla propria roadmap tecnologica non corrispondono ai fatti, senza per\u00f2 entrare nei dettagli.<\/p><p>La notizia resta comunque rilevante perch\u00e9 tocca uno degli elementi pi\u00f9 delicati nell\u2019evoluzione delle HBM: il passaggio, a partire da <strong>HBM4<\/strong>, da un processo di tipo memory a uno di tipo logic per il base die. \u00c8 un cambio tecnico importante, che incide su prestazioni, consumi e soprattutto costi di produzione.<\/p>\n  <\/div><figure class=\"wp-block-image size-large\" style=\"margin:18px 0;display:block;clear:both;width:100%;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/08\/sk-hynix-frena-sulle-voci-su-intel-foundry-per-i-base-die-hbm-f78b4f33-11f1-4abd-9a63-5503-asc2o.jpg\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/08\/sk-hynix-frena-sulle-voci-su-intel-foundry-per-i-base-die-hbm-f78b4f33-11f1-4abd-9a63-5503-asc2o.jpg\" alt=\"SK \u6d77\u529b\u58eb\u56de\u5e94\u201c\u8003\u8651\u59d4\u6258\u82f1\u7279\u5c14\u5236\u9020 HBM \u5185\u5b58\u57fa\u7840\u88f8\u7247\u201d\u62a5\u9053\uff1a\u90e8\u5206\u5185\u5bb9\u4e0d\u5b9e\" loading=\"lazy\" style=\"display:block;max-width:100%;height:auto;margin:0 auto;pointer-events:auto\"><\/a><\/figure>\n  \n\n      <section class=\"fbp5-section\">\n        \n        <h2>Il base die HBM diventa pi\u00f9 complesso con il <span>salto a HBM4<\/span><\/h2>\n        <p>Dalle generazioni HBM1 fino a HBM3E, il base die poteva essere realizzato con lo stesso processo usato per i die DRAM, perch\u00e9 le esigenze della parte logica restavano compatibili con una piattaforma produttiva di tipo memory. Con HBM4, invece, l\u2019aumento della complessit\u00e0 e dei requisiti in termini di <strong>PPA<\/strong>, ci\u00f2\u00e8 prestazioni, consumi e area del chip, spinge verso un processo logic dedicato.<\/p><p>In questo scenario, SK Hynix avrebbe gi\u00e0 adottato per HBM4 un nodo produttivo a <strong>12 nm<\/strong> di TSMC. Il passaggio non \u00e8 banale: il base die \u00e8 la fondazione del package HBM e gestisce funzioni chiave nell\u2019interconnessione e nel controllo dei vari stack di memoria. Quando questa componente richiede una tecnologia pi\u00f9 avanzata, il costo complessivo della memoria ad alta banda pu\u00f2 salire in modo sensibile.<\/p>\n        \n        \n        \n        \n        \n      <\/section>\n    \n\n      <section class=\"fbp5-section\">\n        \n        <h2>Perch\u00e9 si parla di Intel Foundry come possibile <span>alternativa a TSMC<\/span><\/h2>\n        <p>Le indiscrezioni sostenevano che Intel Foundry potesse entrare nella catena di fornitura a partire dalla generazione HBM4E, interrompendo l\u2019esclusiva di fatto di TSMC su questa parte della produzione. Il punto centrale non riguarda solo la capacit\u00e0 industriale, ma anche il potere negoziale: affidarsi a un unico fornitore per un componente strategico pu\u00f2 ridurre i margini di manovra sui prezzi.<\/p><p>Le stesse ricostruzioni indicavano infatti che i base die prodotti da TSMC avrebbero un costo sensibilmente superiore rispetto ai die DRAM realizzati internamente da SK Hynix. L\u2019apertura a un secondo partner manifatturiero avrebbe quindi un senso soprattutto economico, oltre che industriale.<\/p>\n        \n        \n        \n        \n        \n      <\/section>\n    \n\n      <section class=\"fbp5-section\">\n        \n        <h2>Una notizia da seguire perch\u00e9 incide su costi e disponibilit\u00e0 delle <span>HBM future<\/span><\/h2>\n        <p>Al di l\u00e0 della smentita parziale, il tema resta centrale per tutto il settore AI e data center. Le memorie HBM sono ormai un componente critico per acceleratori e GPU di fascia alta, e ogni variazione nella filiera del base die pu\u00f2 riflettersi su volumi, tempi di consegna e prezzi finali.<\/p><p>Per questo la questione va letta pi\u00f9 come un segnale strategico che come una decisione gi\u00e0 presa. Se SK Hynix dovesse davvero diversificare i fornitori nelle prossime generazioni, il mercato potrebbe vedere una filiera pi\u00f9 flessibile. Per ora, per\u00f2, l\u2019unico dato solido \u00e8 che la transizione tecnica verso base die pi\u00f9 avanzati \u00e8 gi\u00e0 in corso e rende la partita produttiva molto pi\u00f9 delicata rispetto alle HBM precedenti.<\/p>\n        \n        \n        \n        \n        \n      <\/section>\n    \n<\/div><div class=\"rh-attribution-pills\" style=\"display:flex;gap:10px;flex-wrap:wrap;justify-content:flex-start;margin:16px 0 0\"><a href=\"https:\/\/www.ithome.com\/0\/996\/413.htm\" target=\"_blank\" rel=\"noopener\" title=\"Via: VIA\" aria-label=\"Via: VIA\" style=\"display:inline-flex;align-items:center;gap:8px;padding:10px 16px;border-radius:16px;background:linear-gradient(135deg,#fff7ed,#ffedd5);color:#c2410c;text-decoration:none;font-size:11px;font-weight:900;letter-spacing:.08em;text-transform:uppercase;border:1px solid rgba(249,115,22,.20);box-shadow:0 8px 22px rgba(249,115,22,.08)\">Via<\/a><\/div>\n","protected":false},"excerpt":{"rendered":"<p>SK Hynix ha smentito in parte le voci sull\u2019uso di Intel Foundry per i base die HBM, ma il passaggio a HBM4 conferma una crescente complessit\u00e0 produttiva.<\/p>\n","protected":false},"author":15,"featured_media":45442,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_exactmetrics_skip_tracking":false,"_yoast_wpseo_focuskw_text_input":"SK Hynix Intel Foundry HBM4","footnotes":""},"categories":[480],"tags":[],"class_list":["post-45443","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"blocksy_meta":{"styles_descriptor":{"styles":{"desktop":"","tablet":"","mobile":""},"google_fonts":[],"version":8}},"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>SK Hynix frena sulle voci su Intel Foundry per i base die HBM<\/title>\n<meta name=\"description\" content=\"SK Hynix contesta parte delle indiscrezioni sull\u2019uso di Intel Foundry per i base die HBM. 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