{"id":32245,"date":"2026-06-25T11:17:08","date_gmt":"2026-06-25T09:17:08","guid":{"rendered":"https:\/\/www.chinasmartbuy.com\/blog\/?p=32245"},"modified":"2026-06-25T10:14:00","modified_gmt":"2026-06-25T08:14:00","slug":"qualcomm-dragonfly-hbc-c1000-ai300-data-center","status":"publish","type":"post","link":"https:\/\/www.chinasmartbuy.com\/blog\/qualcomm-dragonfly-hbc-c1000-ai300-data-center\/","title":{"rendered":"Qualcomm Dragonfly per data center: HBC, CPU C1000 e AI300"},"content":{"rendered":"\n<link href=\"https:\/\/fonts.googleapis.com\/css2?family=Bebas+Neue&amp;family=DM+Sans:ital,wght@0,300;0,400;0,500;0,600;0,700;1,400&amp;display=swap\" rel=\"stylesheet\">\n<style>\n  :root {\n    --red: #CC1B1B;\n    --red-light: rgba(204,27,27,0.08);\n    --red-mid: #e84040;\n    --accent-soft-bg: rgba(204,27,27,0.07);\n    --accent-soft-border: rgba(204,27,27,0.18);\n    --text: #1a1a1a;\n    --text-muted: #666;\n    --card: #ffffff;\n    --border: #ebebeb;\n    --page-bg: #ffffff;\n    --surface-soft: #fafafa;\n    --surface-contrast: #f0f0f0;\n    --line-soft: #f5f5f5;\n    --soft-label: #bbb;\n    --muted-label: #999;\n    --copy: #333;\n    --font-head: 'Bebas Neue', sans-serif;\n    --font-body: 'DM Sans', sans-serif;\n    --heading-spacing: 0.04em;\n    --heading-weight: 400;\n    --spec-header-spacing: 0.08em;\n    --quickfacts-shadow: 0 10px 24px rgba(15,23,42,0.06);\n  }\n  .fbp5-wrap,.fbp5-wrap * { box-sizing:border-box; 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flex-shrink:0; }\n  .fbp5-scheda-val { padding:11px 16px; font-size:14px; color:var(--text); font-weight:500; line-height:1.5; }\n  @media(max-width:600px) {\n    .fbp5-wrap { padding:0 14px 60px; gap:40px; }\n    .fbp5-section h2 { font-size:32px; }\n    .fbp5-scheda-row { flex-direction:column; }\n    .fbp5-scheda-key { width:100%; }\n    .rh-phonebox-header { padding:18px 16px; flex-direction:column; align-items:center; }\n    .rh-phonebox-hero { width:150px; height:200px; }\n    .rh-phonebox-highlights { grid-template-columns:repeat(2,minmax(0,1fr)); }\n    .rh-phonebox-colors { padding:16px; }\n    .rh-phonebox-section { grid-template-columns:1fr; }\n    .rh-phonebox-section-label { padding:14px 20px; border-right:none; border-bottom:1px solid var(--border); }\n    .rh-phonebox-section-values { padding:14px 20px; }\n    .rh-affbox-grid { grid-template-columns:1fr; }\n    .rh-affbox-col:not(:last-child) { border-right:none; border-bottom:1px solid var(--line-soft); }\n    .rh-affbox-cta { width:100%; }\n    .rh-downloadbox-head { flex-direction:column; }\n    .rh-downloadbox-link { width:100%; }\n    .rh-offerbox-head { flex-direction:column; }\n    .rh-offerbox-links { grid-template-columns:1fr; }\n    .rh-offer-inline-wrap { flex-direction:column; align-items:flex-start; }\n    .rh-offer-inline-cta { width:100%; }\n  }\n<\/style>\n<div class=\"fbp5-wrap rh-json-article\" id=\"rh-article-mqsxh5a5-5l9oo\" data-rh-article-type=\"news\" data-rh-site-profile=\"china-smart-buy\">\n  <div class=\"fbp5-intro\">\n    \n    <p>Qualcomm ha presentato la nuova famiglia Dragonfly per il data center, una piattaforma che mette insieme architettura <strong>HBC<\/strong>, CPU <strong>C1000<\/strong> e acceleratore per inferenza <strong>AI300<\/strong>, oltre a servizi di progettazione chip e soluzioni di interconnessione ad alta velocit\u00e0.<\/p><p>Il punto centrale dell&#8217;annuncio \u00e8 l&#8217;approccio modulare alla memoria e al calcolo: l&#8217;azienda promette pi\u00f9 efficienza energetica, maggiore banda memoria effettiva e un costo totale di sistema pi\u00f9 basso rispetto alle piattaforme basate su HBM, con una roadmap che si estende fino al 2028.<\/p>\n  <\/div><div class=\"rh-inline-gallery rh-inline-gallery-cols-2\" style=\"display:grid;grid-template-columns:repeat(2,minmax(0,1fr));gap:14px;margin:18px 0;position:relative;z-index:1\"><figure class=\"wp-block-image size-large\" style=\"margin:0;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/06\/qualcomm-dragonfly-per-data-center-4b483a2c-5e36-4b53-8de3-c46c-19pfgm51dz.jpg\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;height:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/06\/qualcomm-dragonfly-per-data-center-4b483a2c-5e36-4b53-8de3-c46c-19pfgm51dz.jpg\" alt=\"\u9ad8\u901a\u5e26\u6765 Dragonfly \u6570\u636e\u4e2d\u5fc3\u4ea7\u54c1\u7ec4\u5408\uff1aHBC \u67b6\u6784\u3001C1000 CPU\u3001AI300 \u63a8\u7406\u52a0\u901f\u5668\" loading=\"lazy\" style=\"display:block;width:100%;height:auto;pointer-events:auto\"><\/a><\/figure><figure class=\"wp-block-image size-large\" style=\"margin:0;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/06\/qualcomm-dragonfly-per-data-center-c41fbe1d-ef03-446b-8b5c-7f61-10c582dm6r.jpg\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;height:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/06\/qualcomm-dragonfly-per-data-center-c41fbe1d-ef03-446b-8b5c-7f61-10c582dm6r.jpg\" alt=\"\u9ad8\u901a\u5e26\u6765 Dragonfly \u6570\u636e\u4e2d\u5fc3\u4ea7\u54c1\u7ec4\u5408\uff1aHBC \u67b6\u6784\u3001C1000 CPU\u3001AI300 \u63a8\u7406\u52a0\u901f\u5668\" loading=\"lazy\" style=\"display:block;width:100%;height:auto;pointer-events:auto\"><\/a><\/figure><\/div>\n  \n\n      <section class=\"fbp5-section\">\n        <div class=\"fbp5-section-label\">Architettura<\/div>\n        <h2>Qualcomm punta su HBC per aumentare banda <span>memoria ed efficienza<\/span><\/h2>\n        <p>La base tecnica della proposta Dragonfly \u00e8 HBC, un&#8217;architettura disaggregata che separa il chip in un SoC principale e in uno stack HBC, entrambi collocati su un normale substrato organico 2D. All&#8217;interno dello stack HBC si trova in basso un&#8217;unit\u00e0 di accelerazione vicina alla memoria, mentre sopra vengono impilati i die LPDDR DRAM tramite tecnologia TSV.<\/p><p>Qualcomm sostiene che questo schema permetta di migliorare sia l&#8217;efficienza energetica sia la banda memoria realmente disponibile rispetto alle soluzioni con HBM. A livello di acceleratore completo, HBC \u00e8 progettata per arrivare a <strong>6 volte la banda per watt<\/strong> rispetto a HBM e a <strong>200 volte la capacit\u00e0 per watt<\/strong> rispetto a SRAM.<\/p><p>Il primo prodotto a sfruttare HBC Gen 1 sar\u00e0 l&#8217;acceleratore AI250: la scheda raggiunge una velocit\u00e0 di lettura e scrittura memoria di <strong>133 TB<\/strong>\/s e una banda effettiva pari a 18 volte quella di AI200, che usa <strong>LPDDR5X<\/strong> standard. I campioni commerciali sono attesi da met\u00e0 2027.<\/p>\n        <ul class=\"fbp5-bullet-list\"><li>HBC divide il chip in SoC principale e stack memoria\/accelerazione separato.<\/li><li>Lo stack usa LPDDR DRAM impilata con tecnologia TSV.<\/li><li>Obiettivo dichiarato: pi\u00f9 efficienza e minore TCO rispetto ai sistemi con HBM.<\/li><li>AI250 con HBC Gen 1 arriva a <strong>133 TB\/s<\/strong> di traffico memoria sulla singola scheda.<\/li><\/ul>\n        <div class=\"rh-quickfacts-grid\">\n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Campioni AI250<\/div>\n        <div class=\"rh-quickfacts-value\">Previsti da met\u00e0 2027<\/div>\n      <\/div>\n    <\/div>\n        <div class=\"fbp5-highlight\">HBC \u00e8 la vera novit\u00e0 tecnica dell&#8217;annuncio: Qualcomm prova a differenziarsi dalla concorrenza puntando su LPDDR impilata e su una gestione della memoria pi\u00f9 efficiente del classico approccio HBM.<\/div>\n        <div class=\"fbp5-info\">Per chi segue il settore server e acceleratori AI, il dato pi\u00f9 interessante \u00e8 che Qualcomm non propone solo un nuovo chip, ma una base architetturale pensata per scalare su pi\u00f9 generazioni.<\/div>\n        \n      <div class=\"fbp5-scheda\">\n        <div class=\"fbp5-scheda-header\">Numeri chiave di HBC e AI250<\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Banda per watt vs HBM<\/div>\n            <div class=\"fbp5-scheda-val\">Fino a 6 volte<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Capacit\u00e0 per watt vs SRAM<\/div>\n            <div class=\"fbp5-scheda-val\">Fino a 200 volte<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Velocit\u00e0 memoria AI250<\/div>\n            <div class=\"fbp5-scheda-val\">133 TB\/s<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Banda effettiva AI250 vs AI200<\/div>\n            <div class=\"fbp5-scheda-val\">18 volte<\/div>\n          <\/div>\n        \n      <\/div>\n    \n      <\/section>\n    \n\n      <section class=\"fbp5-section\">\n        <div class=\"fbp5-section-label\">CPU server<\/div>\n        <h2>Dragonfly C1000 \u00e8 la nuova CPU Qualcomm per <span>carichi data center<\/span><\/h2>\n        <p>Con Dragonfly C1000, Qualcomm rientra in modo deciso nel segmento CPU per data center con un progetto dedicato ai carichi server moderni. Il chip adotta un&#8217;architettura multi-chip e pu\u00f2 scalare oltre <strong>250 core Oryon<\/strong>, con frequenze superiori a 5 GHz.<\/p><p>Sul piano della piattaforma, C1000 usa un sottosistema di memoria LP DRAM e pu\u00f2 integrare una connessione HBC opzionale. Sono supportati PCIe Gen 7 e la compatibilit\u00e0 con lo standard CXL, due elementi importanti per espansione, acceleratori esterni e memoria condivisa nei server di nuova generazione.<\/p><p>Qualcomm dichiara inoltre un&#8217;efficienza energetica superiore di oltre 2 volte rispetto ai concorrenti attuali, con varianti dedicate a carichi per agenti AI, uso generale e nodi head node. Il debutto commerciale \u00e8 previsto nel 2028.<\/p>\n        <ul class=\"fbp5-bullet-list\"><li>Architettura multi-chip per il data center.<\/li><li>Scalabilit\u00e0 fino a <strong>oltre 250 core Oryon<\/strong>.<\/li><li>Frequenza massima superiore a <strong>5 GHz<\/strong>.<\/li><li>Supporto a PCIe Gen 7, CXL, raffreddamento ad aria e a liquido.<\/li><li>Compatibilit\u00e0 con rack e server standard OCP ORv3.<\/li><\/ul>\n        <div class=\"rh-quickfacts-grid\">\n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Lancio previsto<\/div>\n        <div class=\"rh-quickfacts-value\">2028<\/div>\n      <\/div>\n    \n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Memoria<\/div>\n        <div class=\"rh-quickfacts-value\">LP DRAM con opzione HBC<\/div>\n      <\/div>\n    <\/div>\n        <div class=\"fbp5-highlight\">C1000 \u00e8 il tassello pi\u00f9 ambizioso della roadmap: non solo acceleratori AI, ma una CPU server completa che punta a densit\u00e0 di core, frequenze elevate e integrazione con memoria e interconnessioni di nuova generazione.<\/div>\n        <div class=\"fbp5-info\">Il posizionamento lascia intendere una piattaforma pensata per cluster AI e infrastrutture cloud dove contano consumi, modularit\u00e0 e supporto agli standard aperti.<\/div>\n        \n      <div class=\"fbp5-scheda\">\n        <div class=\"fbp5-scheda-header\">Specifiche annunciate per C1000<\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Core CPU<\/div>\n            <div class=\"fbp5-scheda-val\">Oltre 250 Oryon<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Frequenza<\/div>\n            <div class=\"fbp5-scheda-val\">Oltre 5 GHz<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Interfaccia I\/O<\/div>\n            <div class=\"fbp5-scheda-val\">PCIe Gen 7<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Compatibilit\u00e0<\/div>\n            <div class=\"fbp5-scheda-val\">CXL e OCP ORv3<\/div>\n          <\/div>\n        \n      <\/div>\n    \n      <\/section>\n    \n\n      <section class=\"fbp5-section\">\n        <div class=\"fbp5-section-label\">Inferenza AI<\/div>\n        <h2>AI300 mira all&#8217;inferenza distribuita con pi\u00f9 capacit\u00e0 memoria e <span>scalabilit\u00e0 di rack<\/span><\/h2>\n        <p>L&#8217;altro pilastro della gamma Dragonfly \u00e8 AI300, acceleratore di terza generazione in formato rack con raffreddamento ad aria o a liquido, progettato per scenari di inferenza distribuita. Qualcomm indica l&#8217;avvio dei campioni commerciali nel 2028.<\/p><p>Grazie a HBC Gen 2, AI300 dovrebbe offrire una capacit\u00e0 memoria e una banda effettiva ai vertici del settore. La banda memoria per watt della singola scheda viene indicata come <strong>4-8 volte superiore<\/strong> rispetto alle GPU attuali, mentre la banda effettiva sarebbe 3 volte quella di AI250 e 54 volte quella di AI200.<\/p><p>Per la scalabilit\u00e0 verticale la piattaforma usa UALink ed ESUN, mentre per la scalabilit\u00e0 orizzontale fa leva sia su collegamenti in rame sia su fibra. A completare il quadro ci sono le tecnologie di interconnessione Qualcomm, con stack SerDes, PAM4 e DSP coerente leggero, capaci di coprire connessioni dal chip al campus con supporto a 800G e 1.6T.<\/p>\n        <ul class=\"fbp5-bullet-list\"><li>Piattaforma AI300 di terza generazione per inferenza distribuita.<\/li><li>Supporto a raffreddamento ad aria e a liquido.<\/li><li>Banda memoria per watt fino a <strong>4-8 volte<\/strong> rispetto alle GPU attuali.<\/li><li>Interconnessioni fino a <strong>800G e 1.6T<\/strong> su rame e fibra.<\/li><\/ul>\n        <div class=\"rh-quickfacts-grid\">\n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Campioni commerciali<\/div>\n        <div class=\"rh-quickfacts-value\">Previsti nel 2028<\/div>\n      <\/div>\n    \n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Scalabilit\u00e0 verticale<\/div>\n        <div class=\"rh-quickfacts-value\">UALink ed ESUN<\/div>\n      <\/div>\n    <\/div>\n        <div class=\"fbp5-highlight\">AI300 mostra dove vuole andare Qualcomm: inferenza AI su larga scala, forte attenzione alla memoria e un&#8217;infrastruttura di collegamento pensata per crescere dal singolo chip fino al rack e oltre.<\/div>\n        <div class=\"fbp5-info\">Nella stessa presentazione Qualcomm ha messo in evidenza anche le sue capacit\u00e0 end-to-end su chip, sistema e software, oltre ai servizi di design per clienti che vogliono portare un ASIC dal progetto alla produzione.<\/div>\n        \n      <div class=\"fbp5-scheda\">\n        <div class=\"fbp5-scheda-header\">Dati chiave per AI300 e interconnessioni<\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Banda per watt vs GPU attuali<\/div>\n            <div class=\"fbp5-scheda-val\">Da 4 a 8 volte<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Banda effettiva vs AI250<\/div>\n            <div class=\"fbp5-scheda-val\">3 volte<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Banda effettiva vs AI200<\/div>\n            <div class=\"fbp5-scheda-val\">54 volte<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Velocit\u00e0 interconnessione<\/div>\n            <div class=\"fbp5-scheda-val\">800G e 1.6T<\/div>\n          <\/div>\n        \n      <\/div>\n    \n      <\/section>\n    \n<\/div><div class=\"rh-attribution-pills\" style=\"display:flex;gap:10px;flex-wrap:wrap;justify-content:flex-start;margin:16px 0 0\"><a href=\"https:\/\/www.ithome.com\/0\/968\/257.htm\" target=\"_blank\" rel=\"noopener\" title=\"Via: VIA\" aria-label=\"Via: VIA\" style=\"display:inline-flex;align-items:center;gap:8px;padding:10px 16px;border-radius:16px;background:linear-gradient(135deg,#fff7ed,#ffedd5);color:#c2410c;text-decoration:none;font-size:11px;font-weight:900;letter-spacing:.08em;text-transform:uppercase;border:1px solid rgba(249,115,22,.20);box-shadow:0 8px 22px rgba(249,115,22,.08)\">Via<\/a><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Qualcomm debutta con Dragonfly per il data center: HBC, CPU C1000 e AI300 puntano su memoria pi\u00f9 efficiente, alta banda e scalabilit\u00e0 AI.<\/p>\n","protected":false},"author":15,"featured_media":32244,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_exactmetrics_skip_tracking":false,"_yoast_wpseo_focuskw_text_input":"Qualcomm Dragonfly data center","footnotes":""},"categories":[480],"tags":[462],"class_list":["post-32245","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-qualcomm"],"blocksy_meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Qualcomm Dragonfly per data center: HBC, CPU C1000 e AI300<\/title>\n<meta name=\"description\" content=\"Qualcomm svela la piattaforma Dragonfly per data center con architettura HBC, CPU C1000 e acceleratore AI300. 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