{"id":27393,"date":"2026-05-14T21:34:00","date_gmt":"2026-05-14T19:34:00","guid":{"rendered":"https:\/\/www.chinasmartbuy.com\/blog\/?p=27393"},"modified":"2026-05-14T19:09:43","modified_gmt":"2026-05-14T17:09:43","slug":"galaxy-s27-exynos-2700-fowlp","status":"publish","type":"post","link":"https:\/\/www.chinasmartbuy.com\/blog\/galaxy-s27-exynos-2700-fowlp\/","title":{"rendered":"Samsung Galaxy S27: Exynos 2700 potrebbe rinunciare a FOWLP"},"content":{"rendered":"\n\n<style>\n  :root {\n    --red: #CC1B1B;\n    --red-light: rgba(204,27,27,0.08);\n    --red-mid: #e84040;\n    --accent-soft-bg: rgba(204,27,27,0.07);\n    --accent-soft-border: rgba(204,27,27,0.18);\n    --text: #1a1a1a;\n    --text-muted: #666;\n    --card: #ffffff;\n    --border: #ebebeb;\n    --page-bg: #ffffff;\n    --surface-soft: #fafafa;\n    --surface-contrast: #f0f0f0;\n    --line-soft: #f5f5f5;\n    --soft-label: #bbb;\n    --muted-label: #999;\n    --copy: #333;\n    --font-head: 'Bebas Neue', sans-serif;\n    --font-body: 'DM Sans', sans-serif;\n    --heading-spacing: 0.04em;\n    --heading-weight: 400;\n    --spec-header-spacing: 0.08em;\n    --quickfacts-shadow: 0 10px 24px rgba(15,23,42,0.06);\n  }\n  .fbp5-wrap,.fbp5-wrap * { box-sizing:border-box; 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}\n  }\n<\/style>\n<div class=\"fbp5-wrap rh-json-article\" id=\"rh-article-mp5qty2h-tbsl9\" data-rh-article-type=\"news\" data-rh-site-profile=\"china-smart-buy\">\n  <div class=\"fbp5-intro\">\n    \n    <p>Samsung starebbe valutando un taglio di costo sul prossimo <strong>Exynos 2700<\/strong>, il chip atteso a bordo della serie <strong>Galaxy S27<\/strong>. Il punto critico riguarda l\u2019abbandono del packaging <strong>FOWLP<\/strong>, una tecnologia che aveva debuttato con Exynos 2400 per migliorare dimensioni, temperature e prestazioni.<\/p><p>L\u2019ipotesi \u00e8 interessante perch\u00e9 mostra la direzione del progetto: pi\u00f9 attenzione ai margini industriali, ma con il rischio di cambiare l\u2019equilibrio tra consumi, dissipazione e resa del chip. Non \u00e8 ancora chiaro come questa scelta impatter\u00e0 sul prodotto finale.<\/p>\n  <\/div><figure class=\"wp-block-image size-large\" style=\"margin:18px 0;display:block;clear:both;width:100%;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/05\/samsung-galaxy-s27-samsung-exynos-2500-fowlp-gkwvtg27fc.webp\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/05\/samsung-galaxy-s27-samsung-exynos-2500-fowlp-gkwvtg27fc.webp\" alt=\"samsung exynos 2500 fowlp\" loading=\"lazy\" style=\"display:block;max-width:100%;height:auto;margin:0 auto;pointer-events:auto\"><\/a><\/figure>\n  \n\n      <section class=\"fbp5-section\">\n        <div class=\"fbp5-section-label\">Chip e packaging<\/div>\n        <h2>Samsung potrebbe rinunciare al packaging FOWLP su <span>Exynos 2700<\/span><\/h2>\n        <p>Il nodo centrale \u00e8 il <strong>Fan-Out Wafer-Level Packaging (FOWLP)<\/strong>, una tecnica di packaging avanzata che aiuta a rendere i chip pi\u00f9 compatti, sottili ed efficienti. In pratica sposta parte delle connessioni elettriche fuori dall\u2019area del die, aumentando il numero di pin disponibili in uno spazio ridotto rispetto ai metodi tradizionali.<\/p><p>Su <strong>Exynos 2400<\/strong> questa soluzione era stata introdotta nel 2024 per <strong>Galaxy S24<\/strong> e <strong>Galaxy S24+<\/strong>, con effetti positivi sulla gestione termica e sulle prestazioni. Il rovescio della medaglia era rappresentato da costi pi\u00f9 alti e rese produttive pi\u00f9 basse, due aspetti che Samsung starebbe ora cercando di correggere su Exynos 2700.<\/p>\n        <ul class=\"fbp5-bullet-list\"><li>FOWLP migliora compattezza, spessore e gestione delle connessioni del chip.<\/li><li><strong>Exynos 2400<\/strong> \u00e8 stato il primo Samsung a usare questa soluzione su Galaxy S24 e S24+.<\/li><li>La possibile rinuncia a FOWLP punta a ridurre i costi di produzione e a migliorare la redditivit\u00e0.<\/li><li>La scelta potrebbe per\u00f2 influire su temperature e comportamento energetico del chip finale.<\/li><\/ul>\n        <div class=\"rh-quickfacts-grid\">\n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Chip atteso<\/div>\n        <div class=\"rh-quickfacts-value\">Exynos 2700<\/div>\n      <\/div>\n    \n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Serie di debutto<\/div>\n        <div class=\"rh-quickfacts-value\">Galaxy S27<\/div>\n      <\/div>\n    \n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Tecnologia in discussione<\/div>\n        <div class=\"rh-quickfacts-value\">FOWLP<\/div>\n      <\/div>\n    \n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Obiettivo industriale<\/div>\n        <div class=\"rh-quickfacts-value\">Riduzione dei costi<\/div>\n      <\/div>\n    <\/div>\n        <div class=\"fbp5-highlight\">L\u2019eventuale abbandono di FOWLP non \u00e8 solo una scelta tecnica: potrebbe segnare un compromesso tra efficienza del chip e controllo dei costi di produzione.<\/div>\n        <div class=\"fbp5-info\">FOWLP \u00e8 gi\u00e0 stata usata da Samsung per <strong>Exynos 2400<\/strong>, ma la sua complessit\u00e0 pu\u00f2 incidere su costi e rese. Per questo viene considerata una leva su cui intervenire nella generazione successiva.<\/div>\n        \n      <\/section><figure class=\"wp-block-image size-large\" style=\"margin:18px 0;display:block;clear:both;width:100%;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/05\/samsung-galaxy-s27-samsung-exynos-2600-ram-heat-1iijh2pt5h.webp\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/05\/samsung-galaxy-s27-samsung-exynos-2600-ram-heat-1iijh2pt5h.webp\" alt=\"samsung exynos 2600 ram heat path block hpb\" loading=\"lazy\" style=\"display:block;max-width:100%;height:auto;margin:0 auto;pointer-events:auto\"><\/a><\/figure>\n    \n\n      <section class=\"fbp5-section\">\n        <div class=\"fbp5-section-label\">Gestione termica<\/div>\n        <h2>Exynos 2700 potrebbe puntare sul sistema SbS per <span>smaltire il calore<\/span><\/h2>\n        <p>Se FOWLP venisse eliminato, Samsung dovrebbe affidarsi a un altro approccio per la gestione del calore. In questo scenario entra in gioco il sistema <strong>Side-by-Side (SbS)<\/strong>, una soluzione che posiziona il blocco di dissipazione sia sul processore sia sulla DRAM, affiancando i due componenti sullo stesso substrato.<\/p><p>L\u2019idea \u00e8 migliorare la dispersione termica in modo pi\u00f9 diretto, agendo sia sul chip sia sulla memoria. Samsung aveva gi\u00e0 usato sul chip <strong>Exynos 2600<\/strong> il sistema <strong>Heat Path Block (HPB)<\/strong>, collocato sopra il processore accanto a DRAM e storage in una configurazione package-on-package.<\/p>\n        <ul class=\"fbp5-bullet-list\"><li>SbS affianca processore e DRAM sullo stesso substrato.<\/li><li>Il blocco di dissipazione lavora su entrambe le aree, non solo sul chip principale.<\/li><li><strong>Exynos 2600 ha gi<\/strong>\u00e0 introdotto HPB come soluzione di raffreddamento interna.<\/li><li>Resta da vedere se SbS baster\u00e0 a compensare l\u2019eventuale rinuncia a FOWLP.<\/li><\/ul>\n        \n        <div class=\"fbp5-highlight\">Samsung sembra voler spostare la complessit\u00e0 dal packaging alla dissipazione, ma la riuscita del progetto dipender\u00e0 dall\u2019equilibrio tra consumi, calore e costi.<\/div>\n        <div class=\"fbp5-info\">Al momento non ci sono dati ufficiali sulle prestazioni finali di <strong>Exynos 2700<\/strong>: le conseguenze reali di queste scelte si vedranno solo quando il chip arriver\u00e0 sul mercato.<\/div>\n        \n      <div class=\"fbp5-scheda\">\n        <div class=\"fbp5-scheda-header\">Soluzioni termiche citate<\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Exynos 2400<\/div>\n            <div class=\"fbp5-scheda-val\">FOWLP<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Exynos 2600<\/div>\n            <div class=\"fbp5-scheda-val\">Heat Path Block<\/div>\n          <\/div>\n        \n          <div class=\"fbp5-scheda-row\">\n            <div class=\"fbp5-scheda-key\">Exynos 2700<\/div>\n            <div class=\"fbp5-scheda-val\">Side-by-Side<\/div>\n          <\/div>\n        \n      <\/div>\n    \n      <\/section><figure class=\"wp-block-image size-large\" style=\"margin:18px 0;display:block;clear:both;width:100%;position:relative;z-index:1\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/05\/samsung-galaxy-s27-samsung-exynos-2700-side-by-aqzkxp1h10.webp\" target=\"_blank\" rel=\"noopener\" style=\"display:block;width:100%;position:relative;z-index:2;pointer-events:auto;cursor:zoom-in\"><img decoding=\"async\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2026\/05\/samsung-galaxy-s27-samsung-exynos-2700-side-by-aqzkxp1h10.webp\" alt=\"samsung exynos 2700 side-by-side expanded heat path block concept illustration\" loading=\"lazy\" style=\"display:block;max-width:100%;height:auto;margin:0 auto;pointer-events:auto\"><\/a><\/figure>\n    \n\n      <section class=\"fbp5-section\">\n        <div class=\"fbp5-section-label\">Specifiche rumor<\/div>\n        <h2>Exynos 2700 \u00e8 indicato con processo a 2 nanometri, CPU a 10 core e <span>GPU Xclipse 970<\/span><\/h2>\n        <p>Tra le specifiche circolate per <strong>Exynos 2700<\/strong> c\u2019\u00e8 il passaggio al processo produttivo <strong>2 nanometri di seconda generazione<\/strong> della fonderia Samsung, con l\u2019obiettivo di aumentare l\u2019efficienza. Il chip sarebbe inoltre accreditato di una <strong>CPU a 10 core<\/strong> e di una GPU <strong>Xclipse 970<\/strong> basata su architettura <strong>AMD RDNA 5<\/strong>.<\/p><p>Completano il quadro il supporto a <strong>LPDDR6 DRAM<\/strong> e a <strong>UFS 5.0<\/strong> per l\u2019archiviazione. Se confermato, il chip dovrebbe trovare posto su <strong>Galaxy S27<\/strong> e <strong>Galaxy S27+<\/strong> in mercati fuori dal Nord America, mentre non ci sono indicazioni su un impiego universale per tutta la gamma.<\/p>\n        <ul class=\"fbp5-bullet-list\"><li>Processo produttivo indicato: 2 nanometri di seconda generazione.<\/li><li>CPU rumorata con 10 core.<\/li><li>GPU attesa: Xclipse 970 basata su AMD RDNA 5.<\/li><li>Supporto previsto per <strong>LPDDR6<\/strong> e <strong>UFS 5.0<\/strong>.<\/li><li>Possibile uso su Galaxy S27 e Galaxy S27+ in mercati selezionati.<\/li><\/ul>\n        <div class=\"rh-quickfacts-grid\">\n      <div class=\"rh-quickfacts-card\">\n        <div class=\"rh-quickfacts-label\">Memoria<\/div>\n        <div class=\"rh-quickfacts-value\">LPDDR6<\/div>\n      <\/div>\n    <\/div>\n        <div class=\"fbp5-highlight\">Se queste indiscrezioni verranno confermate, <strong>Exynos 2700 punter<\/strong>\u00e0 su un mix molto aggressivo di processo avanzato, nuova GPU e memorie pi\u00f9 rapide.<\/div>\n        <div class=\"fbp5-info\">Per ora Samsung non ha confermato le specifiche del chip. Le informazioni disponibili delineano per\u00f2 un SoC molto ambizioso, con un forte focus su efficienza e integrazione.<\/div>\n        \n      <\/section>\n    \n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Exynos 2700, il chip atteso sui Galaxy S27, potrebbe rinunciare al packaging FOWLP per contenere i costi e cambiare la gestione termica.<\/p>\n","protected":false},"author":5,"featured_media":26512,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_exactmetrics_skip_tracking":false,"_yoast_wpseo_focuskw_text_input":"Galaxy S27 Exynos 2700","footnotes":""},"categories":[480],"tags":[542],"class_list":["post-27393","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-samsung"],"blocksy_meta":{"styles_descriptor":{"styles":{"desktop":"","tablet":"","mobile":""},"google_fonts":[],"version":8}},"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Samsung Galaxy S27: Exynos 2700 potrebbe rinunciare a FOWLP<\/title>\n<meta name=\"description\" content=\"Exynos 2700 del Galaxy S27 potrebbe lasciare il packaging FOWLP per ridurre i costi. 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