{"id":15041,"date":"2025-09-16T08:36:47","date_gmt":"2025-09-16T06:36:47","guid":{"rendered":"https:\/\/www.chinasmartbuy.com\/blog\/?p=15041"},"modified":"2025-09-16T08:36:48","modified_gmt":"2025-09-16T06:36:48","slug":"mediatek-dimensity-9500-lancio-specifiche","status":"publish","type":"post","link":"https:\/\/www.chinasmartbuy.com\/blog\/mediatek-dimensity-9500-lancio-specifiche\/","title":{"rendered":"MediaTek Dimensity 9500: presentazione il 22 settembre e primi dettagli su CPU, GPU e AI (con aggiornamenti sul 2nm Dimensity 9600)"},"content":{"rendered":"\n<p><strong>MediaTek<\/strong> <a href=\"https:\/\/news.mydrivers.com\/1\/1074\/1074841.htm\" target=\"_blank\" rel=\"noreferrer noopener\">ha confermato su Weibo <\/a>l\u2019evento di lancio del suo nuovo SoC di punta: appuntamento il 22 settembre alle 14:00 (ora locale, Cina). Il <strong>Dimensity 9500<\/strong> \u00e8 destinato ai top di gamma di <strong>Vivo<\/strong> e <strong>Oppo<\/strong>, con una successiva estensione ad altri brand. L\u2019annuncio arriva mentre l\u2019azienda anticipa anche i progressi sul suo futuro chip a <strong>2 nm<\/strong>, atteso in produzione di massa nella seconda met\u00e0 del 2026.<\/p>\n\n\n\n<figure class=\"wp-block-image alignleft size-large is-resized\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/mediatek-9500-lancio.jpg\"><img loading=\"lazy\" decoding=\"async\" width=\"576\" height=\"1024\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/mediatek-9500-lancio-576x1024.jpg\" alt=\"mediatek 9500 lancio\" class=\"wp-image-15058\" style=\"width:322px;height:auto\" srcset=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/mediatek-9500-lancio-576x1024.jpg 576w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/mediatek-9500-lancio-169x300.jpg 169w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/mediatek-9500-lancio.jpg 600w\" sizes=\"auto, (max-width: 576px) 100vw, 576px\" \/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">CPU e architettura<\/h2>\n\n\n\n<p>Secondo i report circolati prima dell\u2019evento, il <strong>Dimensity 9500<\/strong> adotterebbe una configurazione CPU <strong>1+3+4<\/strong> con frequenze insolitamente elevate per il mobile:<\/p>\n\n\n\n<p>&#8211; 1 core \u201cTravis\u201d fino a <strong>4,21 GHz<\/strong><\/p>\n\n\n\n<p>&#8211; 3 core \u201cAlto\u201d fino a <strong>3,50 GHz<\/strong><\/p>\n\n\n\n<p>&#8211; 4 core \u201cGelas\u201d fino a <strong>2,70 GHz<\/strong><\/p>\n\n\n\n<p>Le fonti collocano \u201cTravis\u201d e \u201cAlto\u201d nella nuova linea <strong>Arm X9<\/strong>, mentre \u201cGelas\u201d sarebbe parte di una aggiornata serie <strong>A7<\/strong>. La nomenclatura non \u00e8 quella comunemente adottata da Arm (Cortex-X\/A), quindi resta da verificare all\u2019evento. Se confermata, la combinazione suggerirebbe un forte focus su prestazioni single\u2011thread e sostenute.<\/p>\n\n\n\n<p>Sono inoltre indicati <strong>16 MB di cache L3<\/strong>, <strong>10 MB di SLC<\/strong>, e supporto all\u2019insieme di istruzioni <strong>SME<\/strong>, utili per bandwidth e latenza su carichi misti (gaming, AI on\u2011device, foto\/video computazionali).<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Grafica e gaming<\/h2>\n\n\n\n<p>La parte grafica dovrebbe affidarsi a una <strong>Mali\u2011G1 Ultra MC12<\/strong> di nuova architettura, con promesse di efficienza e resa sul ray tracing molto aggressive:<\/p>\n\n\n\n<p>&#8211; Oltre <strong>+40%<\/strong> in efficienza energetica<\/p>\n\n\n\n<p>&#8211; Oltre <strong>+40%<\/strong> nelle prestazioni di <strong>ray tracing<\/strong><\/p>\n\n\n\n<p>&#8211; Frame rate con ray tracing che supererebbe i <strong>100 fps<\/strong> secondo le prime stime<\/p>\n\n\n\n<p>Se i numeri saranno confermati in test indipendenti, il salto permetterebbe sessioni di gioco prolungate con maggiore fedelt\u00e0 grafica, pur restando da valutare il comportamento termico in scenari reali.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">AI e memoria<\/h2>\n\n\n\n<p>Sul fronte AI, si parla di una <strong>NPU 9.0<\/strong> con fino a <strong>100 TOPS<\/strong>, pensata per accelerare inferenza locale e workload multimodali. Lato memoria e storage, il supporto includerebbe <strong>LPDDR5X fino a 10.667 Mbps<\/strong> e <strong>UFS 4.1<\/strong>, combinazione ormai necessaria per alimentare flussi dati e modelli di grandi dimensioni su dispositivo.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-119.png\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"337\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-119.png\" alt=\"\" class=\"wp-image-15060\" srcset=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-119.png 600w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-119-300x169.png 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Primi modelli e benchmark<\/h2>\n\n\n\n<p>I primi smartphone attesi con <strong>Dimensity 9500<\/strong> arriverebbero da <strong>Vivo<\/strong> e <strong>Oppo<\/strong>, con varianti dotate di comunicazione satellitare.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Vivo X300 series<\/h3>\n\n\n\n<p>Il product manager di <strong>Vivo<\/strong> ha anticipato che<a href=\"https:\/\/www.chinasmartbuy.com\/blog\/?s=vivo+x300\" target=\"_blank\" rel=\"noreferrer noopener\"> X300 Pro<\/a> ha superato quota <strong>4 milioni su AnTuTu<\/strong>, primo Android a toccare questo traguardo secondo le dichiarazioni interne. Il debutto della serie \u00e8 atteso (rumor) per il <strong>13 ottobre<\/strong> in Cina.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Oppo Find X9 lineup<\/h3>\n\n\n\n<p>Il punteggio AnTuTu di <strong><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/?s=oppo+find+x9\" target=\"_blank\" rel=\"noreferrer noopener\">Oppo Find X9 Pro<\/a><\/strong> sarebbe ancora pi\u00f9 alto rispetto a X300 Pro, stando a conferme circolate oggi in Cina. La linea Find X9 \u00e8 attesa (rumor) per il <strong>21 ottobre<\/strong>.<\/p>\n\n\n\n<figure class=\"wp-block-image alignleft size-large is-resized\"><a href=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121.png\"><img loading=\"lazy\" decoding=\"async\" width=\"908\" height=\"1024\" src=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121-908x1024.png\" alt=\"\" class=\"wp-image-15062\" style=\"width:481px;height:auto\" srcset=\"https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121-908x1024.png 908w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121-266x300.png 266w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121-768x866.png 768w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121-1362x1536.png 1362w, https:\/\/www.chinasmartbuy.com\/blog\/wp-content\/uploads\/2025\/09\/image-121.png 1440w\" sizes=\"auto, (max-width: 908px) 100vw, 908px\" \/><\/a><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">Prospettive su Dimensity 9600 a 2 nm<\/h2>\n\n\n\n<p>Parallelamente, l\u2019azienda ha riferito progressi sul suo SoC a <strong>2 nm<\/strong>, verosimilmente il <strong>Dimensity 9600<\/strong>, con avvio della produzione di massa nella seconda met\u00e0 del <strong>2026<\/strong>. Il salto di nodo produttivo punta a portare ulteriori guadagni in efficienza e densit\u00e0 logica, elementi chiave per sostenere AI on\u2011device e grafica avanzata di prossima generazione. Resta da capire la foundry e le scelte architetturali definitive.<\/p>\n\n\n\n<p>Il <strong>Dimensity 9500<\/strong> si profila come la risposta di <strong>MediaTek<\/strong> alla nuova ondata di SoC flagship attesi da concorrenti come <strong>Qualcomm<\/strong> e <strong>Apple<\/strong>. Le ambizioni su <strong>ray tracing<\/strong>, <strong>AI (100 TOPS)<\/strong> e clock elevati sono chiare, cos\u00ec come la spinta su memoria e cache. Il posizionamento dipender\u00e0 da tre fattori: stabilit\u00e0 delle frequenze sotto carico prolungato, efficienza reale in scenari quotidiani e qualit\u00e0 dell\u2019integrazione da parte degli OEM. L\u2019adozione da parte di <strong>Vivo<\/strong> e <strong>Oppo<\/strong> indica fiducia nella piattaforma; ora servono verifiche indipendenti per capire se i numeri promessi si tradurranno in un vantaggio tangibile su prestazioni e autonomia.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>MediaTek ha confermato su Weibo l\u2019evento di lancio del suo nuovo SoC di punta: appuntamento il 22 settembre alle 14:00 (ora locale, Cina). Il Dimensity 9500 \u00e8 destinato ai top di gamma di Vivo e Oppo, con una successiva estensione ad altri brand. L\u2019annuncio arriva mentre l\u2019azienda anticipa anche i progressi sul suo futuro chip [&hellip;]<\/p>\n","protected":false},"author":13,"featured_media":13602,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_exactmetrics_skip_tracking":false,"_yoast_wpseo_focuskw_text_input":"","footnotes":""},"categories":[480],"tags":[461],"class_list":["post-15041","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-mediatek"],"blocksy_meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>MediaTek Dimensity 9500: presentazione il 22 settembre e primi dettagli su CPU, GPU e AI (con aggiornamenti sul 2nm Dimensity 9600) - ChinaSmartBuy<\/title>\n<meta name=\"description\" content=\"MediaTek annuncia Dimensity 9500: CPU 1+3+4, GPU con ray tracing 100 fps, NPU 100 TOPS. 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